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NCP380, NCV380
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3
Table 2. MAXIMUM RATINGS
Rating
Symbol
Value
Unit
From IN to OUT Pins: Input/Output (Note 1)
V
IN
 
,
 V
OUT
7.0 to +7.0
V
IN, OUT, EN, ILIM, FLAG
, Pins: Input/Output (Note 1)
V
EN,
 V
ILIM,
 V
FLAG,
 V
IN,
 V
OUT
0.3 to +7.0
V
FLAG
 Sink Current
I
SINK
1
mA
I
LIM
 Source Current
I
LIM
1
mA
ESD Withstand Voltage (IEC 6100042)
(Output Only, when Bypassed with 1.0 mF Capacitor Minimum)
ESD IEC
15 Air, 8 Contact
kV
Human Body Model (HBM) ESD Rating (Note 2)
ESD HBM
2,000
V
Machine Model (MM) ESD Rating (Notes 2 and 3)
ESD MM
200
V
Latch-up Protection (Note 4)
Pins IN, OUT, EN, ILIM, FLAG
LU
100
mA
Maximum Junction Temperature Range (Note 6)
T
J
40 to +TSD
癈
Storage Temperature Range
T
STG
40 to +150
癈
Moisture Sensitivity (Note 5)
MSL
Level 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1.  According to JEDEC standard JESD22A108.
2.  This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) ?.0 kV per JEDEC standard: JESD22A114 for all pins.
Machine Model (MM) ?00 V per JEDEC standard: JESD22A115 for all pins.
3.  Except EN pin, 150 V.
4.  Latch up Current Maximum Rating: ?00 mA per JEDEC standard: JESD78 class II.
5.  Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: JSTD020.
6.  A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.
Table 3. OPERATING CONDITIONS
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
IN
Operational Power Supply
2.5

5.5
V
V
EN
Enable Voltage
0

5.5
T
A
Ambient Temperature Range
40
25
+85
癈
T
J
Junction Temperature Range
40
25
+125
癈
R
ILIM
Resistor from ILIM to GND Pin
5.0

250
kW
I
SINK
FLAG
 Sink Current


1.0
mA
C
IN
Decoupling Input Capacitor
1.0


mF
C
OUT
Decoupling Output Capacitor
USB Port per Hub
120


mF
R
qJA
Thermal Resistance Junction-to-Air
UDFN6 Package (Notes 7 and 8)

120

癈/W
TSOP5 Package (Notes 7 and 8)

305

癈/W
TSOP6 Package (Notes 7 and 8)

280

癈/W
I
OUT
Maximum DC Current
UDFN6 Package


2.1
A
TSOP5, TSOP6 Package


1.0
A
P
D
Power Dissipation Rating (Note 9)
T
A
 v 25癈
UDFN6 Package

 830

mW
TSOP5 Package

325

mW
TSOP6 Package

350

mW
T
A
 = 85癈
UDFN6 Package

325

mW
TSOP5 Package

130

mW
TSOP6 Package

145

mW
7.  A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.
8.  The R
qJA
 is dependent of the PCB heat dissipation. Board used to drive this data was a 2 ?2 NCP380EVB board. It is a 2 layers board
with 2-once copper traces on top and bottom of the board. Exposed pad is connected to ground plane for UDFN6 version only.
9.  The maximum power dissipation (P
D
) is given by the following formula:
P
D
+
T
JMAX
* T
A
R
qJA
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